높은 permittivity F4BK-1/2의 테플론 이용한 동박클래드 라미네이트

Types

F4BK225

F4BK265

Dielectric Constant

2.25

2.65

Dimension（mm）

300×250     380×350     440×550     500×500    460×610      600×500

840×840     1200×1000     1500×1000

For special dimension，customized laminates is available.

Thickness and Tolerance（mm）

Laminate thickness

0.25

0.5

0.8

1.0

Tolerance

±0.025

±0.05

±0.05

±0.05

Laminate thickness

1.5

2.0

3.0

4.0

5.0

Tolerance

±0.05

±0.075

±0.09

±0.10

±0.10

The laminate thickness includes the   copper thickness. For special dimension，customized   laminates is available.

Mechanical Strength

Warp

Thickness（mm）

Maximum Warp

Original board

Single side

Double side

0.25～0.5

0.030

0.050

0.025

0.8～1.0

0.025

0.030

0.020

1.5～2.0

0.020

0.025

0.015

3.0～5.0

0.015

0.020

0.010

Cutting/punching

Strength

Thickness1mm，no burrs after cutting，minimum space   between two punching holes is 0.55mm，no delamination.

Thickness1mm，no burrs after cutting，minimum space   between two punching holes is 1.10mm，no delamination.

Peel strength（1oz copper）

Normal state：≥12N/cm；No bubble、delamination、peel strength≥10N/cm（in the constant   humidity and temperature、and keep in the   melting solder of 260℃±2℃ for 20 seconds）.

Chemical Property

According to the properties of laminate，the chemical etching method for PCB can be used. The dielectric   properties of laminate are not changed. The plating through hole can be done，but the sodium treatment or the plasma treatment must be used.

Electrical Property

Name

Test condition

Unit

Value

Density

Normal state

g/ cm3

2.2～2.3

Moisture Absorption

Dip in the distilled water of 20±2℃ for24 hours

%

≤0.1

Operating Temperature

High-low temperature chamber

℃

-50℃～+250℃

Thermal Conductivity

W/m/k

0.3

CTE

（typical）

0～100℃

（εr ：2.1~2.3）

ppm/℃

25（x）

34（y）

240（z）

CTE

（typical）

0～100℃

（εr ：2.3~2.9）

ppm/℃

16（x）

21（y）

186（z）

Shrinkage Factor

2 hours in boiling water

%

 0.0002

Surface Resistivity

500V

DC

Normal state

M·Ω

≥3×104

Constant humidity and temperature

≥8×103

Volume Resistivity

Normal state

MΩ.cm

≥2×106

Constant humidity and temperature

≥2×105

Surface dielectric strength

Normal state

d=1mm（Kv/mm）

≥1.2

Constant humidity and temperature

≥1.1

Dielectric Constant

10GHZ

εr

2.25，2.65

（±2%）

Dissipation Factor

10GHZ

tgδ

≤1.5×10-3