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PCB Material

PCB Material

PCB Material

PCB Material

높은 permittivity F4BK-1/2의 테플론 이용한 동박클래드 라미네이트

F4BK-1/2는 과학적 제조 및 엄격한 기술 공정에 따라 테플론 수지 PTFE로 쌓아 적층됩니다. 이 제품은 전기적 성능 (더 넓은 범위의 유전체 상수)에서 F4B 시리즈에 비해 몇 가지 장점을 취합니다.  

기술사양

Appearance

Meet the specification requirements for   the laminate of microwave PCB

by National and Military Standards.

Types

F4BK225

F4BK265




Dielectric Constant

2.25

2.65




Dimensionmm

300×250     380×350     440×550     500×500    460×610      600×500

840×840     1200×1000     1500×1000

For special dimensioncustomized laminates is available.

Thickness and Tolerancemm

Laminate thickness

0.25

0.5

0.8

1.0


Tolerance

±0.025

±0.05

±0.05

±0.05


Laminate thickness

1.5

2.0

3.0

4.0

5.0

Tolerance

±0.05

±0.075

±0.09

±0.10

±0.10

The laminate thickness includes the   copper thickness. For special dimensioncustomized   laminates is available.

Mechanical Strength

Warp

Thicknessmm

Maximum Warp

Original board

Single side

Double side

0.250.5

0.030

0.050

0.025

0.81.0

0.025

0.030

0.020

1.52.0

0.020

0.025

0.015

3.05.0

0.015

0.020

0.010

Cutting/punching

Strength

Thickness1mmno burrs after cuttingminimum space   between two punching holes is 0.55mmno delamination.

Thickness1mmno burrs after cuttingminimum space   between two punching holes is 1.10mmno delamination.

Peel strength1oz copper

Normal state:≥12N/cmNo bubbledelaminationpeel strength10N/cmin the constant   humidity and temperatureand keep in the   melting solder of 260℃±2 for 20 seconds.

Chemical Property

According to the properties of laminatethe chemical etching method for PCB can be used. The dielectric   properties of laminate are not changed. The plating through hole can be donebut the sodium treatment or the plasma treatment must be used.

 

Electrical Property

Name

Test condition

Unit

Value

Density

Normal state

g/ cm3

2.22.3

Moisture Absorption

Dip in the distilled water of 20±2 for24 hours

%

0.1

Operating Temperature

High-low temperature chamber

-50℃~+250

Thermal Conductivity


W/m/k

0.3

CTE

typical

0100

(εr 2.1~2.3

ppm/

25x

34y

240z

CTE

typical

0100

(εr 2.3~2.9

ppm/

16x

21y

186z

Shrinkage Factor

2 hours in boiling water

%

 0.0002

Surface Resistivity

500V

DC

Normal state

M·Ω

3×104

Constant humidity and temperature

8×103

Volume Resistivity

Normal state

MΩ.cm

2×106

Constant humidity and temperature

2×105

Surface dielectric strength

Normal state

d=1mmKv/mm

1.2

Constant humidity and temperature

1.1

Dielectric Constant

10GHZ

εr

2.252.65

(±2%

Dissipation Factor

10GHZ

tgδ

1.5×10-3






















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