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| No. | Item-Double/Multi Layers | Description | Data and Model |
| 1 | Layer | Layer | 1-70 |
| 2 | Material | Brand | SY、ITEQ、KB、NOUYA |
| 3 | Surface treatment | HASL lead-free,Immersion Gold、OSP、Immersion Tin、Immersion Silver、Plating Gold、Plating Tin、ENEPIG | |
| 4 | Selectivity surface treatment | ENIG+OSP、ENIG+G/F、Flash Gold+G/F、Immersion Silver+G/F、Immersion Tin+G/F | |
| 5 | Solder mask color | green.yellow.black.matte black.blue.red.white.matte green | |
| 6 | Silkscreen color | White,yellow,black | |
| 7 | Max board size with 2L | mm | 2000*500 |
| 8 | Max board size with 4L,6L | mm | 570*850 or 1150*430(Exceeding 570MM shall be reviewed) |
| 9 | Max board size with more than 8L | mm | 570*670 or 980*430(Exceeding 570MM shall be reviewed) |
| 10 | MiN board size | mm | 0.5*1.0mm(thickness≤0.5mm)、1.0*2.0mm(thickness≥0.5mm) |
| 11 | Min outline tolerance | mm | ±0.05mm(Laser Routing) 、±0.1mm(Mechanical Routing) |
| 12 | Board Thickness | mm | 0.13-8mm |
| 13 | Double side board thickness | mm | 0.13-3.6mm |
| 14 | 4Layers board thickness | mm | 0.30-7mm |
| 15 | 6Layers board thickness | mm | 0.6-8mm(6L)、0.8-8mm(8L)、1.0-8mm(10L)、1.0-8mm(12L) |
| 16 | The tolerance of board thickness | mm | ±0.1mm(thickness≤1.0mm)、±10%mm(thickness>1.0mm) |
| 17 | Min Drilling hole size | mm | 0.075-0.1mm(Laser)、0.15mm(Mechanical) |
| 18 | Single Max Drilling | mm | 6.5mm(Drill Bit) |
| 19 | Max Drilling | mm | 50mm |
| 20 | Min PTH tolerance | mm | ±0.05mm、±0.075mm |
| 21 | Min NPTH tolerance | mm | ±0.05mm(Limitation+0、-0.05mm or +0.05、-0mm) |
| 22 | Min hole tolerance | mm | ±0.075mm |
| 23 | Max Drilling tolerance | mm | ±0.1mm |
| 24 | Slot hole | mm | 0.5-6mm |
| 25 | Min slot hole length | mm | 1.0mm |
| 26 | Slot hole aspect ratio | mm | 1:2 |
| 27 | Min slot hole tolerance | mm | Slot width、±0.15mm |
| 28 | Min slot hole tolerance | mm | Slot width direction±0.10、slot length direction±0.15 |
| 29 | Countersink hole angle & size | Big hole82、90、120degree、dia≤10mm | |
| 30 | Countersink hole angle & size | PTH & NPTH、Big hole angle 130degree、The dia of the large hole is not greater than 6.3mm | |
| 31 | Min pattern width / spacing | mm | 0.075mm/0.075mm |
| 32 | Pattern width tolerance | mm | ±20um |
| 33 | Min pad | mm | 0.15mm |
| 34 | FR-4 PP | 106、1080、3313、2116、7628 | |
| 35 | Mult press blind buried hole production | Press on the same side≤5 | |
| 36 | Max bore diameter of pad hole plug hole | mm | 0.4 Multi press blind & buried hole board |
| 37 | Min thickness of inner | mm | 0.05(none blind buried hole)、0.13(blind buried hole) |
| 38 | Min inner | mil | 3(18um base copper)、4(35um base copper)、≥3mil |
| 39 | Inner layer treatment | Brown Oxygen | |
| 40 | Min inner pattern spacing(105um base copper、after compensation) | mil | 5 |
| 41 | Min inner layer pattern spacing(140um base copper、after compensation) | mil | 7 |
| 42 | Min innner layer pattern spacing(18um base copper、after compensation) | mil | 3 |
| 43 | Min inner layer pattern spacing(35um base copper、after compensation) | mil | 3.5 |
| 44 | Min inner layer pattern spacing(70um base copper、after compensation) | mil | 4 |
| 45 | Min inner layer pattern width(105umbase copper、before compensation) | mil | 5 |
| 46 | Min inner layer pattern width(140um base copper、before compensation) | mil | 7 |
| 47 | Min inner layer pattern width(18um base copper、before compensation) | mil | 3 |
| 48 | Min inner layer pattern width(35um base copper、before compensation) | mil | 3 |
| 49 | Min inner layer pattern width(70um base copper、before compensation) | mil | 4 |
| 50 | Min outer layer pattern spacing(105um base copper、after compensation) | mil | 6 |
| 51 | Min outer layer pattern spacing(12、18um base copper、after compensation) | mil | 3.0(18um)、2.5(12um) |
| 52 | Min outer layer pattern spacing(140um base copper、after compensation) | mil | 7 |
| 53 | Min outer layer pattern spacing(35um base copper、after compensation) | mil | 3.5 |
| 54 | Min outer layer pattern spacing (70um base copper、after compensation) | mil | 5 |
| 55 | Min outer layer pattern width(105um base copper、before compensation) | mil | 8 |
| 56 | Min outer layer pattern width(12、18um base copper、before compensation) | mil | 3.5(18um)、3(12um) |
| 57 | Min outer layer pattern width(140um base copper、before compensation) | mil | 9 |
| 58 | Min outer layer pattern width(35um base copper、before compensation) | mil | 4.5 |
| 59 | Min outer layer pattern width(70um base copper、before compensation) | mil | 6 |
| 60 | Min.spacing from pattern to pad, pad to pad for outer layer(after compensation) | mil | 3(12、18um)、3.5(35um)、5(70um)、6(105、140um) |
| 61 | Min.outer pattern and spacing with blind/buried holes plated many times(>=2 times) | mil | 3.5/3.5 (before compensation) |
| 62 | Min distance from inner layer edge without copper leakage | mil | 10 |
| 63 | Min inner layer isolation width | mil | 8 |
| 64 | Min inner layer isolation ring width(unilateral) | mil | 8(≤6layer)、10(≥8layer) |
| 65 | Min single side width of inner pad（none blind buried hole） | mil | 4.5(18、35um、Can be partial 4)、6(70um)、8(105um) |
| 66 | Min single side width of inner pad（laser hole） | mil | 3 |
| 67 | Impedance tolerance | % | ±5Ω(<50Ω)、±10%(≥50Ω);≥50Ω可±5% （need to evaluate when it requests）、 |
| 68 | Min BGA pad diameter | mil | 7mil |
| 69 | Min pad diameter | mil | 12(0.10mmMechanical or laser drilling) |
| 70 | Min hole copper thinckness（none blind buried hole） | um | average 25、min single point≥20 |
| 71 | Min hole copper thinckness(blind buried hle ) | um | averager 20、min single point≥18 |
| 72 | PP thickness(min) | um | 0.075(only H oz base copper) |
| 73 | ENIG: gold thickness | um | 0.025-0.10 |
| 74 | ENIG; nickle thickness | um | 3-5 |
| 75 | Immersion silver.silver thickness | um | 0.1-0.3 |
| 76 | Min HASL LeadFree/pure tin thickness | um | 0.4 |
| 77 | Gold Finger:gold thickness | um | 0.25-1.3(The required value is the thinnest point) |
| 78 | Gold Finger:nickle thickness | um | 3-5 |
| 79 | Flash Gold: gold thickness | um | 0.025-0.10 |
| 80 | Golden finger chamfer Angle tolerance | ±5° | |
| 81 | Golden finger chamfering margin tolerance | mil | ±5 |
| 82 | Min gold finger length | inch | 2 |
| 83 | Min distance between gold fingers | mil | 6 |
| 84 | Gold finger next to the TAB does not hurt the min distance | mm | 7(Means automatic chamfering) |
| 85 | Long and short gold finger | Can be combined with various surface treatments | |
| 86 | Surface treatment for long and short gold finger | Immersion gold；Flash gold | |
| 87 | Immersion tin:Tin thickness | um | 0.8-1.5 |
| 88 | Electroplate hard gold thick | um | 0.15-1.3 |
| 89 | Flash Gold: nickle thickness | um | 3-5 |
| 90 | Max borad thickness of mechanical drilling 0.10mm | mm | 0.60 |
| 91 | Max borad thickness of mechanical drilling 0.15mm | mm | 1.20 |
| 92 | Max borad thickness of router bit 0.25mm | mm | 5 |
| 93 | Bow and twist capability limit | % | 0.1(need to evaluate when it requests ≤0.3） |
| 94 | Max Dry film sealing slot | 5mm*3.0mm；More than one side of sealing hole15mil | |
| 95 | Min unilateral width of dry film sealing hole | mil | 10 |
| 96 | Max diameter of dry film sealing hole | mm | 4.5 |
| 97 | Min width of solder mask opening | mil | 8 |
| 98 | Min solder mask thickness | um | 10 |
| 99 | Min S/M bridge width | mil | 3(green)、5(other color)(base copper≤1OZ)(base coppe2-4OZ、All in accordance with the 6mil) |
| 100 | Min unilateral width of solder mask | mil | 2.5(Allow local2mil) |
| 101 | Min solder mask opening (sing side) | mil | 2(Flash gold local 1.5、other allow local 1) |
| 102 | Max diameter of ink plug hole(both side) | mm | 0.65 |
| 103 | Thickness of solder mask ink through hole cover | um | 5/8 |
| 104 | V-CUT Angle specifications | 20°、30°、45°、60° | |
| 105 | V-CUT(1.0<h≤1.6mm)< td=""> | mm | 0.36(20°)、0.4(30°)、0.5(45°)、0.6(60°) |
| 106 | V-CUT(1.6<h≤2.4mm)< td=""> | mm | 0.42(20°)、0.51(30°)、0.64(45°)、0.8(60°) |
| 107 | V-CUT(2.5≤H≤3.0mm) | mm | 0.47(20°)、0.59(30°)、0.77(45°)、0.97(60°) |
| 108 | V-CUT(H≤1.0mm) | mm | 0.3(20°)、0.33(30°)、0.37(45°)、0.42(60°) |
| 109 | V-CUT Symmetry tolerance | mil | ±4 |
| 110 | V-CUT Angle tolerance | o | ±5° |
| 111 | V-CUT Residue thickness | mil | ±4 |
| 112 | Blue glue white mesh plug hole max diameter | mm | 2 |
| 113 | Min single side of blue cover pattern or pad | mil | 2 |
| 114 | Max diameter of blue plastic aluminum plug hole | mm | 4.5 |
| 115 | Min isolation between blue glue and pad | mil | 12 |
| 116 | Min single side carbon cap pattern | mil | 2 |
| 117 | Min isolation between carbon and pad | mil | 8 |
| 118 | Min isolation between carbon and carbon | mil | 12 |
| 119 | Min gridding spacing | mil | 5（12、18、35 um）、8（70 um） |
| 120 | Min gridding width | mil | 5（12、18、35 um）、10（70 um） |
| 121 | Min silk width and height(12、18um base copper) | width4mil；height：23mil | |
| 122 | Min silk width and height(35um base copper) | width5mil；height：30mil | |
| 123 | Min silk width and height(70um base copper) | width 6mil；height：45mil | |
| 124 | Min isolation of silk and pad | mil | 6 |
| 125 | Min test on resistance | Ω | 10 |
| 126 | Min distance from test point to edge | mm | 0.5 |
| 127 | Max test current | mA | 200 |
| 128 | Max test voltage | V | 250 |
| 129 | WNH | mil | 3.9 |
| 130 | Min test pad | mil | 3.9 |
| 131 | Min etch logo width | mil | 8(12、18um)、10(35um)、12（70um） |
| 132 | Outline tolerance(edge to edge) | mil | ±4(Complex outlin and inner grooves with this requirement shall be reviewed) |
| 133 | Min inner angular radius | mm | 0.4 |
| 134 | Depth control slot hole（edge）or Blind slot precision（NPTH） | mm | ±0.10 |
| 135 | Special tolerance requirements for board thickness（No interlayer structure requirement） | mm | ≤2.0±0.1；2.0-3.0±0.15；≥3.0±0.2 |
| 136 | Max ratio of plate thickness to hole | 20:1(not inclue≤0.2mm diameter、more than 12:1 shall be reviewed)) | |
| 137 | Min hole diameter | mm | 0.45 |
| 138 | Outline method | Routing,V-CUT,Stamp-hole | |
| 139 | Min router bit diameter of outline | mm | 0.6 |
| 140 | Min. distance from hole to trace(Not blind/buried holes) | mil | 6(≤8layers)、8(≤14layers)、9(≤28layers) |
| 141 | Min. distance from hole to trace (blind / buried holes) | mil | 9(Press one time)；10(press two times or three times) |
| 142 | Min distance from hole to trace(Laser drill, 1 or 2-step) | mil | 6 |
| 143 | Min single-sided width for via hole pad of outer layer | mil | 4(12、18um)3.5、4.5(35um)、6(70um)、8(105um)、10（140um） |
| 144 | Min. distance without copper exposure when outline routing | mil | 8 |
| 145 | Maximum insulation resistance(for test) | MΩ | 100 |
| 146 | Hole resistance test board thickness limit | mm | 0.38-5.0 |
| 147 | Hole resistance test aperture limit | mm | min:0.62mm、max0.25mm |
| 148 | ionic soil | ug/cm2 | ≤1 |
| 149 | Copper stripping strength | N/cm | 7.8 |
| 150 | Resistance weld hardness | H | 6 |
| 151 | Resistance | 94V-0 | |
| 152 | RCC material | um | copper foil:12,resin:65,100um(complete55、90um) |
| 153 | Thkickness of blue glue | mm | 0.2-0.5 |
| 154 | Min carbon pattern width | mm | 0.5mm |
| 155 | Hole resistance test aperture limit |
