No. | ITEM | Description | Data & Model |
1 | Material | Brand | SY、ITEQ、KB、NOUYA |
2 | HDI Construction | | 1+N+1、2+N+2、3+N+3、4+N+4、5+N+5、6+N+6、anylayer |
3 | Construction order | | N+N、N+X+N、1+(N+X+N)+1 |
4 | Layer | | 1-40Layers |
5 | Min Pattern Width / Spacing | Unit:mil | 2/2 |
6 | Min Mechanical Hole | Unit:mm | 0.15mm |
7 | Min Thickness of Core Board | Unit:mil | 2mil |
8 | Laser Hole | Unit:mm | 0.075mm- 0.1mm |
9 | Min thickness of PP | Unit:mil | 2mil |
10 | Max diameter of resin plug hole | Unit:mm | 0.4mm |
11 | Electroplating to fill holes | | Can do it. |
12 | Electroplating to fill holes size | Unit:mil | 3-5mil |
13 | hole pile pad/hole pile hole/pad hole(VOP) | mil | Can do it. |
14 | The distance from the wall of via hole to the pattern | mil | 7mil |
15 | Laser drilling hole accuracy | mil | 0.025mm |
16 | Min BGA pad center distance | mil | 0.3mm |
17 | Min SMT | mil | 0.25mm |
18 | Plating hole-filling sag | mil | ≤10um |
19 | Back drilled/countersink hole tolerance | mil | ±0.05mm |
20 | Through-hole plating penetration capacity | Rate | 16:1 |
21 | Blind hole plating penetration capacity | Rate | 1.2:1 |
22 | BGA min PAD | Unit:mil | 0.2 |
23 | Min Buried Hole(Mechanical Hole) | Unit:mil | 0.2 |
24 | Min Buried Hole(Laser Hole) | Unit:mil | 0.1 |
25 | Min Blind Hole(Laser Hole) | Unit:mil | 0.1 |
26 | Min Blind Hole(Mechanical Hole) | Unit:mil | 0.2 |
27 | Minimum spacing between laser blind hole and mechanical buried hole | Unit:mil | 0.2 |
28 | Min Laser Hole | Unit:mil | 0.10(depth≤55um)、0.13(depth≤100um) |
29 | MinBGA pad center distance | Unit:mil | 0.3 |
30 | Interlaminar alignment | Unit:mil | ±0.05mm(±0.002") |
| | | The distance from the wall of via hole to the pattern |