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| No. | ITEM | Description | Data & Model |
| 1 | Material | Brand | SY、ITEQ、KB、NOUYA |
| 2 | HDI Construction | 1+N+1、2+N+2、3+N+3、4+N+4、5+N+5、6+N+6、anylayer | |
| 3 | Construction order | N+N、N+X+N、1+(N+X+N)+1 | |
| 4 | Layer | 1-40Layers | |
| 5 | Min Pattern Width / Spacing | Unit：mil | 2/2 |
| 6 | Min Mechanical Hole | Unit：mm | 0.15mm |
| 7 | Min Thickness of Core Board | Unit：mil | 2mil |
| 8 | Laser Hole | Unit：mm | 0.075mm- 0.1mm |
| 9 | Min thickness of PP | Unit：mil | 2mil |
| 10 | Max diameter of resin plug hole | Unit：mm | 0.4mm |
| 11 | Electroplating to fill holes | Can do it. | |
| 12 | Electroplating to fill holes size | Unit：mil | 3-5mil |
| 13 | hole pile pad/hole pile hole/pad hole(VOP) | mil | Can do it. |
| 14 | The distance from the wall of via hole to the pattern | mil | 7mil |
| 15 | Laser drilling hole accuracy | mil | 0.025mm |
| 16 | Min BGA pad center distance | mil | 0.3mm |
| 17 | Min SMT | mil | 0.25mm |
| 18 | Plating hole-filling sag | mil | ≤10um |
| 19 | Back drilled/countersink hole tolerance | mil | ±0.05mm |
| 20 | Through-hole plating penetration capacity | Rate | 16:1 |
| 21 | Blind hole plating penetration capacity | Rate | 1.2:1 |
| 22 | BGA min PAD | Unit：mil | 0.2 |
| 23 | Min Buried Hole(Mechanical Hole) | Unit：mil | 0.2 |
| 24 | Min Buried Hole(Laser Hole) | Unit：mil | 0.1 |
| 25 | Min Blind Hole(Laser Hole) | Unit：mil | 0.1 |
| 26 | Min Blind Hole(Mechanical Hole) | Unit：mil | 0.2 |
| 27 | Minimum spacing between laser blind hole and mechanical buried hole | Unit：mil | 0.2 |
| 28 | Min Laser Hole | Unit：mil | 0.10(depth≤55um)、0.13(depth≤100um) |
| 29 | MinBGA pad center distance | Unit：mil | 0.3 |
| 30 | Interlaminar alignment | Unit：mil | ±0.05mm(±0.002") |
| The distance from the wall of via hole to the pattern |
