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PCB기술

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PCB기술

PCB기술

Brief introduction of PCB process flow
2019-07-23
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Author:ipcb      Share

Process flow of circuit board


[1] The following is a summary of a common difference method, to briefly introduce the classification of PCB [2] and its production method basic internal substantive significance [3] [4] PCB production process


Objectives:
The large plate is cut into small pieces with various specifications.



Facilities and utility:

  1. Semi automatic cutting machine: cut the large material into various fine materials.
    2. Fillet grinding machine: round the dust end of the plate corner.
    3. Washing machine: clean and air dry the dust and impurities on the board machine.
    4. Oven: furnace plate, increase the stability of plate.
    5. Character marking machine; type the mark on the edge of the board for marking.


Operation specification:


1. Check the setting size before starting the semi-automatic opening machine to avoid opening wrong materials.

2. After the inner layer plate is opened, it should be noted to mark the horizontal and vertical materials, and do not be out of order.

3. Gloves should be worn on the transportation board, which should be handled carefully to avoid rubbing the surface of the board.

4. Pay attention to the waterless stains on the board surface after washing. It is strictly forbidden to bake with water stains to avoid oxygenation.

5. Check the temperature setting value before starting the oven.


Safety and environmental protection precautions:
1. Do not put your hand into the machine when the opening machine is started.

2. Do not put paper paper and other flammable materials beside the oven to avoid fire.

3. The oven temperature should not exceed the specified value.

4. Asbestos gloves should be worn to remove the plate from the oven, and the plate should not be taken until it has cooled down.

5. Waste materials should be disposed in strict accordance with mei001 to avoid background pollution.

Cutting board

  1. Facilities: manual cutting machine, milling target machine, CCD drilling machine, gong machine, edging machine, marking machine, thickness gauge;

  2. Utility: laminate shape processing, forming at the beginning stage;

  3.  Process flow: dismantling plate → drawing line by dot → cutting large plate → milling copper skin → punching → forming Gong edge → grinding edge → typing mark → measuring plate thickness

  4.  Attention items:
    a. Cut the large plate and cut the bevel edge;
    b. Milling copper skin into the unit;
    c. CCD drilling slant hole;
    d. The surface of the board is scratched.



Items for attention in environmental protection:


1. All kinds of scrap materials such as p-sheet and copper foil are gathered together by the production department and returned to the warehouse;

2. The powder of gongs and plates formed in the inner layer, drilling cuttings of PL machine and waste frame are collected and sold by the production department;

3. Other discarded items such as wrinkled adhesive paper, waste sticky paper and waste cloth are put into the dustbin and collected by the cleaner. Waste gloves and masks are returned to the warehouse by the production department.

4. The waste water generated by the mill plate can not be directly discharged, but should be discharged to the waste water department through the waste water discharge pipe, and can be discharged after the treatment without damage.