로저스 (Arlon) AD250C,AD255C,AD260A 소재 사양

Rogers(Arlon) ad250c, ad255c, ad260a 마이크로웨이브 고주파 PCB 재료는 저유전율, 저비용, 우수한 저손실 특성을 가진 3세대 상용 마이크로웨이브 및 RF 적층판이다.  

Rogers(Arlon) ad250c, ad255c, ad260a 마이크로웨이브 고주파 PCB 소재는 복합화학과 아키텍처의 비용 효율적인 조합을 기반으로 오늘날의 통신 인프라에 비교할 수 없는 가격 성능 비를 제공합니다.  

Rogers(Arlon) ad250c, ad255c, ad260a 마이크로웨이브 고주파 PCB 재료는 fluoropolymer 수지 시스템의 우수한 열 특성과 선택된 세라믹 재료 및 유리 섬유 강화 재료를 결합하여 낮은 손실 (DF = 0.0014 at 10GHz), 낮은 열팽창 특성 및 낮은 수동 상호 변조 (PIM)의 적층을 얻습니다. 비용 측면에서 ad250c는 또한 Arlon Rogers ad250c, ad255c, ad260a 마이크로파 고주파 PCB 제품의 추가 개선을 나타냅니다.  

넓은 주파수 및 온도 범위에 걸쳐 낮은 손실 특성을 갖는 PTFE의 안정성으로 인해 Rogers(Arlon) ad250c, ad255c, ad260a 마이크로웨이브 고주파 PCB 소재는 통신 인프라의 다양한 마이크로웨이브 및 RF 애플리케이션에 매우 적합합니다. 미분 분산 세라믹스의 첨가는 낮은 CTE와 highe의 형태로 열 안정성을 제공합니다  

r temperature phase stability.

Rogers(Arlon) ad250c, Rogers ad255c, Rogers ad260a microwave high frequency PCB materials

The net combination of materials properties of Rogers ad250c, ad255c, ad260a microwave high frequency PCB is ideal for applications with high frequency and high gain and broadband signal material performance life expectancy, which generally exceeds the performance capabilities provided by low loss thermos bottles.

Rogers(Arlon) ad250c, ad255c, ad260a microwave high frequency PCB materials are compatible with the process of standard PTFE printed circuit board substrate. Its low z-axis thermal expansion improves the reliability of plated through-hole (PTH) compared to typical PTFE base platens. Low X-Y expansion improves the reliability of BGA Solder Joints.

Rogers(Arlon) ad250c, Rogers ad255c, Rogers ad260a microwave high frequency PCBB materials, Rogers ad series products combine fluoropolymer resin, specific ceramic filler and glass fiber support materials to produce a series of dielectric laminates with low loss, strong mechanical toughness, stable dielectric constant and low passive intermodulation (PIM).

Rogers(Arlon) ad250c, Rogers ad255c, Rogers ad260a microwave high frequency PCB materials is made of polytetrafluoroethylene and glass cloth with a loss factor of 0.0011. The board is soft and difficult to process;.

Product features

Strictly controlled dielectric constant (ad250c ± 0.04, ad255c, ad260a ± 0.04)

Low loss tangent at communication frequency (0.0014 at 10GHz)

The thermal conductivity is higher than that of traditional PTFE / glass fiber

The dielectric constant can be kept stable in a wide range of frequency and temperature

Reverse processing copper foil and im series copper foil have high peel strength and can be provided as conventional materials

advantage

A, High consistency of antenna performance. B, Low insertion loss and high antenna efficiency.  C, Increased power capacity D, The performance of each frequency band is stable, and it is not sensitive to the weather E, PIM values as low as - 165dbc.

Typical applications

PCB for feed network of base station antenna and distributed antenna, Commercial antenna, Digital audio broadcasting (DAB), Patch antenna (GNSS, GPS, SDAR)

If you need microwave high frequency PCB, click here high frequency PCB.