마이크로파 도전성 동박 코팅 기판 TP-1/2

Dimension   and

tolerance

（mm）

Dimensions   A×B（mm）

Tolerance

120×100， 150×150，   160×160， 180×180， 200×200，170×240

-2

Thickness   and Tolerance

0.8±0.05，1.0±0.05，1.2±0.05，1.5±0.06，2.0±0.075，3.0±0.10，4.0±0.10，5.0±0.12，6.0±0.12，10.0±0.2

For   special dimensions，customized lamination is available.

Mechanical   Strength

Peel   strength

In   normal state：≥6N/cm；In the environment of alternating  humidity and temperature：≥4 N/cm .

Chemical   Property

According   to the properties of laminate，the chemical etching   method for PCB can be used. The dielectric properties of materials are not   changed.

Electrical   property

Name

Test   condition

Unit

Value

Density

Normal   state

g/cm3

1.02.9

Moisture

Absorption

Dip   in distilled water of 20±2℃ for 24 hours

%

≤0.02

Operating   Temperature

High-low   temperature chamber

℃

-100～+150（Processing temperature should not   exceed 200℃）

Thermal   Conductivity

-55~288℃

W   /m /k

0.6

CTE

Temperature   rise of 96℃ per hour

   6×10-5

Shrinkage   Factor

2   hours in boiling water

%

0.0004

Surface   Resistivity

500V

 DC

Normal   state

M.Ω

≥1×107

Constant   humidity and temperature

≥1×105

Volume   Resistivity

Normal   state

MΩ.cm

≥1×109

Constant   humidity and temperature

≥1×106

Pin   Resistance

500V   DC

Normal   state

MΩ

≥1×106

Constant   humidity and temperature

≥1×104

Surface   dielectric strength

Normal   state

Kv/mm

≥1.5

Constant   humidity and temperature

≥1.2

Dielectric   Constant

10GHZ

εr

3，6、9.6、10.2、10.5、11、16、20、22（±2%）(dielectric constant canbe customized）

Dissipation   Factor

10GHZ

Tgδ（εr 3-11）

≤1×10-3

Tgδ（εr 12-22）

≤1.5×10-3