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PCB Material

PCB Material

PCB Material

PCB Material

고도의 permittivity F4BMX-1/2 원자재

F4BMX-1/2는 과학적 제형과 엄격한 기술 공정에 따라 수입 니스 처리된 유리 천을 테플론 수지와 Polytrtrafluoroethylene 필름으로 쌓아 적층됩니다. 이 제품은 전기적 성능 (더 넓은 범위의 도전성 상수, 낮은 도전성 손실 각도 접선, 저항 증가, 더 많은 성능의 안정성)에서 F4B 시리즈에 비해 몇 가지 장점을 취하고 있습니다. F4BM과 비교하여 라미네이트 다양한 특성의 일관성은 수입 직조 유리 원단을 사용하는 것을 통해 보험 받을 수 있습니다.  

기술 사양  

Appearance

Meet   the specification requirements for the laminate of microwave PCB

by   National and Military Standards.

Types

F4BMX217

F4BMX220

F4BMX245

F4BMX255

F4BMX265

F4BMX275

Dielectric   Constant

2.17

2.20

2.45

2.55

2.65

2.75

Types

F4BMX285

F4BMX294

F4BMX300




Dielectric   Constant

2.85

2.94

3.0




Dimension(mm)

300×250     380×350     440×550     500×500    460×610      600×500

840×840     840×1200     1500×1000     1800×1000

For   special dimension,customized laminates is available.

Thickness   and Tolerance(mm)

Laminate   thickness

0.25

0.5

0.8

1.0


Tolerance

±0.025

±0.05

±0.05

±0.05


Laminate   thickness

1.5

2.0

3.0

4.0

5.0

Tolerance

±0.05

±0.075

±0.09

±0.10

±0.10

Laminate   thickness

6.0

8.0

10.0

12.0

(Thickness≥5.0mm,dimension≤600x500 )

Tolerance

±0.12

±0.15

±0.18

±0.2


The   laminate thickness includes the copper thickness. For special dimension,customized   laminates is available.

Mechanical   Strength

Warp

Thickness(mm)

Maximum   Warp

Original   board

Single   side

Double   side

0.25~0.5

0.030

0.050

0.025

0.8~1.0

0.025

0.030

0.020

1.5~2.0

0.020

0.025

0.015

3.0~5.0

0.015

0.020

0.010

Cutting/punching

Strength

Thickness1mm,no   burrs after cutting,minimum space between two   punching holes is 0.55mm,no delamination.

Thickness1mm,no   burrs after cutting,minimum space between two   punching holes is 1.10mm,no delamination.

Peel   strength(1oz copper)

Normal   state:≥18N/cm;No bubble、delamination、peel strength≥15N/cm(in the constant humidity and temperature、and   keep in the melting solder of 260℃±2℃ for 20 seconds).

Chemical   Property

According   to the properties of laminate,the chemical etching method for PCB can be used. The dielectric   properties of laminate are not changed. The plating through hole can be done,but the sodium treatment or the plasma treatment must be used. The   Hot Air Level temperature can not be higher than 253℃,and can not be repeated.

 

Electrical   Property

Name

Test   condition

Unit

Value

Density

Normal   state

g/   cm3

2.1~2.35

Moisture   Absorption

Dip   in the distilled water of 20±2℃ for24 hours

%

≤0.08

Operating   Temperature

High-low   temperature chamber

-50℃~+260℃

Thermal   Conductivity


W/m/k

0.3~0.5

CTE

(typical)

0~100℃

(εr :2.1~2.3)

ppm/

24(x)

34(y)

235(z)

CTE

(typical)

0~100℃

(εr :2.3~2.9)

ppm/

16(x)

20(y)

168(z)

CTE

(typical)

0~100℃

(εr :2.9~3.38)

ppm/

12(x)

15(y)

92(z)

Shrinkage   Factor

2   hours in boiling water

%

   0.0002

Surface   Resistivity

500V

DC

Normal   state

M·Ω

≥2×105

Constant   humidity and temperature

≥8×104

Volume   Resistivity

Normal   state

MΩ.cm

≥8×106

Constant   humidity and temperature

≥2×105

Surface   dielectric strength

Normal   state

d=1mm(Kv/mm)

≥1.2

Constant   humidity and temperature

≥1.1

Dielectric   Constant

10GHZ

εr

2.17,2.20,2.45,2.55,2.65,2.75,2.85,2.95,3.0。

(±2%)

Dissipation   Factor

10GHZ

tgδ

2.172.2

≤1×10-3

2.453.0

≤1.4×10-3



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