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PCB Material

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PCB Material

PCB Material

무선 주파수 PCB 재료 F4BTM-2기술 사양

F4BTM-2는 과학적인 제형과 엄격한 기술 공정에 따라 수입한 니스 유리 천에 테플론 수지와 나노 세라믹으로 필러를 쌓아 적층합니다. 이 제품은 전기적 성능에서 F4BM 시리즈보다 장점을 취하며, 발열이 향상되고 열팽창 계수가 작다.   


기술사양:

Appearance

Meet   the specification requirements for the laminate of microwave PCB

by   National and Military Standards.

Types

F4BTM-1/2

(255)

F4BTM-1/2

(265)

F4BTM-1/2

(285)

F4BTM-1/2

(294)

F4BTM-1/2

(300)

F4BTM-1/2

(320)

F4BTM-1/2

(338)

F4BTM-1/2

(350)

F4BTM-1/2

(400)

F4BTM-1/2

(440)

F4BTM-1/2

(615)

F4BTM-1/2

(1020)

Dimension(mm)

610×460

600×500

1220×914

1220×1000

1500×1000


For   special dimension,customized laminates is   available.

Thickness   and Tolerance(mm)

Laminate   thickness

0.254

0.508

0.762

0.787

1.016

Tolerance

±0.025

±0.05

±0.05

±0.05

±0.05

Laminate   thickness

1.27

1.524

2.0

3.0

4.0

Tolerance

±0.05

±0.05

±0.075

±0.09

±0.1

Laminate   thickness

5.0

6.0

9.0

10.0

12.0

Tolerance

±0.1

±0.12

±0.18

±0.18

±0.2

Mechanical   Strength

Cutting/punching

Strength

Thickness<1mm,no burrs after cutting,minimum space   between two punching holes is 0.55mm,no delamination.

Thickness³1mm,no burrs after cutting,minimum space   between two punching holes is 1.10mm,no delamination.  

Peel   strength(1oz copper)

Normal   state:≥18N/cm;No bubble、delamination、peel strength≥15N/cm(in the constant humidity and temperature、and   keep in the melting solder of 265℃±2℃ for 20 seconds).

Thermal   stress

After   solder float,260ºC,10s,≥3 times ,no delamination and blister.

Chemical   Property

According   to the properties of laminate,the chemical   etching method for PCB can be used. The dielectric properties of laminate are   not changed. The plating through hole can be done,but   the sodium treatment or the plasma treatment must be used.

 

Electrical   Property

Name

Test   condition

Unit

Value

Density

Normal   state

g/   cm3

2.1~3.0

Moisture   Absorption

Dip   in the distilled water of 20±2℃ for24 hours

%

≤0.05

Operating   Temperature

High-low   temperature chamber

-50℃~+260℃

Thermal   Conductivity


W/m/k

0.6~0.9

CTE

(typical)

-55~288℃

(εr :2.55~3.0)

ppm/

15(x)

15(y)

65(z)

CTE

(typical)

-55~288℃

(εr :3.2~3.5)

ppm/

15(x)

15(y)

55(z)

CTE

(typical)

-55~288℃

(εr :4.0~10.2)

ppm/

12(x)

14(y)

50(z)

Shrinkage   Factor

2   hours in boiling water

%

<   0.0002

Surface   Resistivity

500V

DC

Normal   state

M·Ω

≥1×106

Constant   humidity and temperature

≥1×105

Volume   Resistivity

Normal   state

MΩ.cm

≥1×107

Constant   humidity and temperature

≥1×106

Surface   dielectric strength

Normal   state

d=1mm(Kv/mm)

≥1.2

Constant   humidity and temperature

≥1.1

Dielectric   Constant

10GHZ

εr

2.85±0.05、2.94±0.05

3.00±0.05、3.20±0.05

3.38±0.05、3.50±0.05

4.00±0.08、4.40±0.1

6.15±0.15、10.2±0.25

Thermal   Coefficient ofεr

(PPM/℃)

-50~150

εr

Value

2.85,2.94

-85

3.0,3.2

-75

3.38

-65

3.5

-60

4.0

-60

4.4

-60

6.15

-55

10.2

-50

Dissipation   Factor

10GHZ

tgδ

2.55~3.0

≤1.5×10-3

tgδ

3.0~3.5

≤2.0×10-3

tgδ

4.0~10.20

≤2.5×10-3


UL   Flammability

Rating

94   V-0


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