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Current situation and prospect of High Frequency multilayer PCB bonding sheet
2019-09-12
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Author:ipcb      Share

-Current situation and prospect of High Frequency (High Speed RF) multilayer PCB bonding sheet:

 With the rapid development of modern communication industry, the production of High Frequency copper clad plate has ushered in an unprecedented large market.As one of the basic materials for the production of High-Frequency copper clad PCB, the composition of the material and the related performance indexes of the binder sheet have voted on the successful realization and machinability of the final product quality, character and energy indexes.

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In view of the increasing use of presets of High Frequency PCB medium copperplate, especially the increasing presets of High Frequency PCB medium multilayer board in recent years, it brings unprecedented opportunities and challenges to the majority of PCB production companies.At the same time, higher performance indexes are required for the production of basic materials.
It is well known that for PTFE High-Frequency base materials, the performance index and machinability of adhesive sheet materials vote on the use of High-Frequency copper clad board.Multiple stratification outside, the High Frequency PCB production technology, the focus on High-Frequency multilayer printed substrate production technology of the special nature of the impedance stem technology in the future, choose what kind of bonding sheet material as a whole system, to achieve High Frequency board of multiple stratification, become each preset division and positions of the people must face a tricky problem.


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