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PCB Material

PCB Material

PCB Material

PCB Material

테플론woven glass fabric copper-clad 라미네이트

이 제품은 과학적인 제형과 엄격한 기술 절차를 통해 니스가 칠해진 유리 천, 프리프레그 및 테플론 수지로 제조됩니다. 전기적 성능에서 F4B 시리즈에 비해 좀 더 넓은 범위의 도전성 상수, 낮은 도전성 손실각 탄젠트, 저항 증가 및 더 안정적인 성능 등 일부 장점을 가져간다.  

 

기술 사양  

Appearance

Meet   the specification requirements for microwave PCB baseplate specified in   National and Military Standards.

Types

F4BM220

F4BM255

F4BM265

F4BM300

F4BM350

Permittivity

2.20

2.55

2.65

3.0

3.50

Dimensions(mm)

300×250

350×380

440×550

500×500

460×610

600×500

840×840

840×1200

1500×1000


For   special dimensions, customized lamination is available.

Thickness   and tolerance(mm)

Plate   thickness

0.25

0.5

0.8

1.0


Tolerance

±0.02~±0.04

Plate   thickness

1.5

2.0

3.0

4.0

5.0

Tolerance

±0.05~±0.07

Plate   thickness includes the copper thickness. For special dimensions, customized   lamination is available.

Mechanical   properties

Angularity  

Plate   thickness(mm)

Maximum   angularity mm/mm

Original board

Single-sided   board

Double-sided   board

0.25~0.5

0.03

0.05

0.025

0.8~1.0

0.025

0.03

0.020

1.5~2.0

0.020

0.025

0.015

3.0~5.0

0.015

0.020

0.010

Cutting/   punching property

For   the plate of<1mm, no burrs after cutting, minimum space between two punching   holes is 0.55mm, no separation.

For   the plate of≥1mm, no burrs after cutting, minimum space between two punching   holes is 1.10mm, no separation.

Peel   strength

In   normal state:≥18N/cm; No bubbling, no separation and peel strength ≥15 N/cm   when in the environment of constant humidity and temperature and kept in the   melting solder of 260℃±2℃ for 20 seconds.

Chemical   properties

According   to different properties of baseplates, the chemical etching method for PCB   can be used for the circuit processing, the dielectric properties of   materials are not changed and the holes can be metallized.

 

Electrical     properties

Names

Test   conditions

Unit

Specifications

Gravity

Normal   state

g/cm3

2.2~2.3

Water   absorption rate

Dip   in distilled water of 20±2℃ for 24 hours.

%

≤0.02

Operating   temperature

high-low   temperature chamber

-50~+260

Thermal   conductivity coefficient


Kcal   /m .h.

0.8

Coefficient   of thermal expansion

Temperature   rise of 96℃ per hour

Coefficient   of thermal expansion×1

≤5×10-5

Shrinkage   factor

Two   hours in boiling water

%

0.0002

Surface   insulation resistance

500V   DC

Normal   state

M.Ω

≥1×104

Constant   humidity and temperature

≥1×103

volume   resistance

Normal   state

MΩ.cm

≥1×106

Constant   humidity and temperature

≥1×105

Pin   resistance

500V   DC

Normal   state

≥1×105

Constant   humidity and temperature

≥1×103

Surface   dielectric strength

Normal   state

δ=1mm(kV/mm)

≥1.2

Constant   humidity and temperature

≥1.1

Permittivity

10GHZ

εr

2.           2.20

2.           2.55

2.65(±2%)

2.           3.0

3.5

Dielectric   loss angle tangent

10GHZ

tgδ

≤7×10-4


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