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이 제품은 과학적인 제형과 엄격한 기술 절차를 통해 니스가 칠해진 유리 천, 프리프레그 및 테플론 수지로 제조됩니다. 전기적 성능에서 F4B 시리즈에 비해 좀 더 넓은 범위의 도전성 상수, 낮은 도전성 손실각 탄젠트, 저항 증가 및 더 안정적인 성능 등 일부 장점을 가져간다.
기술 사양
Appearance | Meet the specification requirements for microwave PCB baseplate specified in National and Military Standards. | ||||||||||||
Types | F4BM220 | F4BM255 | F4BM265 | F4BM300 | F4BM350 | ||||||||
Permittivity | 2.20 | 2.55 | 2.65 | 3.0 | 3.50 | ||||||||
Dimensions（mm） | 300×250 | 350×380 | 440×550 | 500×500 | 460×610 | ||||||||
600×500 | 840×840 | 840×1200 | 1500×1000 | ||||||||||
For special dimensions, customized lamination is available. | |||||||||||||
Thickness and tolerance（mm） | Plate thickness | 0.25 | 0.5 | 0.8 | 1.0 | ||||||||
Tolerance | ±0.02～±0.04 | ||||||||||||
Plate thickness | 1.5 | 2.0 | 3.0 | 4.0 | 5.0 | ||||||||
Tolerance | ±0.05～±0.07 | ||||||||||||
Plate thickness includes the copper thickness. For special dimensions, customized lamination is available. | |||||||||||||
Mechanical properties | Angularity | Plate thickness（mm） | Maximum angularity mm/mm | ||||||||||
Original board | Single-sided board | Double-sided board | |||||||||||
0.25～0.5 | 0.03 | 0.05 | 0.025 | ||||||||||
0.8～1.0 | 0.025 | 0.03 | 0.020 | ||||||||||
1.5～2.0 | 0.020 | 0.025 | 0.015 | ||||||||||
3.0～5.0 | 0.015 | 0.020 | 0.010 | ||||||||||
Cutting/ punching property | For the plate of＜1mm, no burrs after cutting, minimum space between two punching holes is 0.55mm, no separation. For the plate of≥1mm, no burrs after cutting, minimum space between two punching holes is 1.10mm, no separation. | ||||||||||||
Peel strength | In normal state:≥18N/cm; No bubbling, no separation and peel strength ≥15 N/cm when in the environment of constant humidity and temperature and kept in the melting solder of 260℃±2℃ for 20 seconds. | ||||||||||||
Chemical properties | According to different properties of baseplates, the chemical etching method for PCB can be used for the circuit processing, the dielectric properties of materials are not changed and the holes can be metallized. | ||||||||||||
Electrical properties | Names | Test conditions | Unit | Specifications | |
Gravity | Normal state | g/cm3 | 2.2～2.3 | ||
Water absorption rate | Dip in distilled water of 20±2℃ for 24 hours. | % | ≤0.02 | ||
Operating temperature | high-low temperature chamber | ℃ | -50～+260 | ||
Thermal conductivity coefficient | Kcal /m .h.℃ | 0.8 | |||
Coefficient of thermal expansion | Temperature rise of 96℃ per hour | Coefficient of thermal expansion×1 | ≤5×10-5 | ||
Shrinkage factor | Two hours in boiling water | % | 0.0002 | ||
Surface insulation resistance | 500V DC | Normal state | M.Ω | ≥1×104 | |
Constant humidity and temperature | ≥1×103 | ||||
volume resistance | Normal state | MΩ.cm | ≥1×106 | ||
Constant humidity and temperature | ≥1×105 | ||||
Pin resistance | 500V DC | Normal state | MΩ | ≥1×105 | |
Constant humidity and temperature | ≥1×103 | ||||
Surface dielectric strength | Normal state | δ=1mm(kV/mm) | ≥1.2 | ||
Constant humidity and temperature | ≥1.1 | ||||
Permittivity | 10GHZ | εr | 2. 2.20 2. 2.55 2.65（±2%） 2. 3.0 3.5 | ||
Dielectric loss angle tangent | 10GHZ | tgδ | ≤7×10-4 | ||
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