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PCB Material

PCB Material

PCB Material

PCB Material

Shengyi S1600 High CTI(CTI ≥ 600V) FR-4 PCB
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC135
TdIPC-TM-650 2.4.24.65% wt. loss310
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃55
After Tgppm/℃308
50-260℃%4.5
Thermal StressIPC-TM-650 2.4.24.13288℃, solder dip-->100S  No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm5.0E + 08
E-24/125MΩ.cm5.0E + 06
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance5.0E + 07
E-24/1255.0E + 06
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s126
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV60
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.7
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.016
IEC 61189-2-72110GHz--
Peel Strength (1oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.8
125℃N/mm1.6
Flexural StrengthLWIPC-TM-650 2.4.4AMPa550
CWIPC-TM-650 2.4.4AMPa450
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105_D-24/23%0.10
CTIIEC60112ARatingPLC 0
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

Remarks:

1. Specification sheet: IPC-4101/21, is for your reference only.

2. All the typical value is based on the 1.6mm specimen,while the Tg is for specimen≥0.50mm.

3. All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanations: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.